Xiaomi Steps Up In-House Chip Push With Xring O3

Prime Highlights

  • Xiaomi unveils its second in-house smartphone processor, Xring O3.
  • The chip could power Xiaomi’s upcoming flagship foldable phone.

Key Facts

  • Xiaomi is a major Chinese smartphone and consumer electronics maker.
  • Xring O1-powered devices have crossed 1 million shipments.

Background

Chinese smartphone maker Xiaomi has unveiled its latest in-house smartphone processor, Xring O3, as it seeks greater control over key components and a stronger supply chain.

The launch marks the company’s next step in developing its own chips and competing with major smartphone makers such as Apple, Samsung Electronics and Huawei. Xiaomi introduced its first proprietary processor, Xring O1, in 2025.

Xring O3 is expected to use advanced 3-nanometre manufacturing technology from Taiwan Semiconductor Manufacturing Company (TSMC), according to people familiar with the plans. The new processor could power Xiaomi’s upcoming flagship foldable smartphone.

The company is reportedly targeting shipments of about 200,000 to 300,000 units for the foldable device. Xiaomi and TSMC have not publicly confirmed the manufacturing details or shipment target.

Smartphone processors, also known as system-on-chips, combine computing, graphics, AI processing and imaging functions into one component. It can provide Xiaomi with greater control over the performance and design of its products without relying on outside vendors for these components.

This is especially true today when many manufacturers try to differentiate themselves through the development of custom chips in smartphones. This trend could reduce dependence on chip suppliers such as Qualcomm and MediaTek.

Xiaomi said its Xring O1-powered devices have crossed 1 million cumulative shipments since the processor was introduced. These devices include smartphones, tablets and smartwatches.

About 150,000 smartphones using the Xring O1 have been sold since its launch in May 2025, according to industry sources.